Feng Zhu1,2, Vineeth Kumar Bandari, 1,2, Jinhui Wang1,2 and Oliver G. Schmidt1,2
1Material Systems for Nanoelectronics, Technische Universität Chemnitz, Germany
2 Institute for Integrative Nanosciences, IFW Dresden, Germany
Organic nanostructure and nanomembranes are of great importance for developing integrated microelectronic circuits and micro-scale energy storage devices [1, 2]. The fabrication of molecular nanodevices decisively relies on the quality of electronic contacts between the organic nanostructures and electrode layers. However, due to the fragile nature of molecular materials, realizing nondestructive contacts on organic nanostructures becomes technically challenging when the metal electrode layers are fabricated by conventional depositions methods, which restrains the great potential of nanoscale organic materials. In the first part, we present a novel contact method based on strained rolled-up nanomembranes to realize robust, soft and reliable contacts with organic nanostructures [3-5]. The fabrication of fully integrated nanodiode arrays on chip scale which consist of self-assembled monolayers and organic nanocrystals will be demonstrated.
Micro-supercapacitors (MSCs) have been regarded as a promising micro-power source for integrated and miniaturized electronics [2, 6]. One ideal strategy to achieve high areal performance is to transform MSCs from two-dimensional (2D) architectures to three-dimensional (3D) architectures with much reduced area. In the second part, we present PEDOT-based 3D tubular MSCs constructed by rolled-up polymeric nanomembranes [7]. The fabrication of on-chip and free-standing MSCs with small footprint area and their performance will be discussed.
References
[1] M. Ratner, Nat. Nano., 8, 378 (2013).
[2] N. A. Kyeremateng, et al., Nat. Nano., 12, 15 (2016).
[3] O. G. Schmidt and K. Eberl, Nature, 410, 168 (2001).
[4] C. C. Bof Bufon, et al., Nano Lett., 11, 3727 (2011).
[5] A. R. Jalil, et al., Adv. Mater., 28, 2971 (2016).
[6] D. Qi, et al., Adv. Mater., 29, 160802 (2017).
[7] J. Wang, et al., Nat. Comm., In submission.